Team Group Inc. was founded in 1997 in Taiwan. To aim at the global layout of R&D technology and manufacturing in memory products, the chairman of the board, Mr. Danny Hsia established the headquarter in 1997 in Taipei. Team Group Inc. possesses professional research and development capabilities, high quality products, rapid productivity, a tightly-knit global sales network and complete customer services. In addition to ranking among CommonWealth Magazine’s top 1000 enterprises, it has also become one of the fastest growing 3C product manufacturer and a world’s leading brand in recent years. Team Group Inc. has been publicly listed on the Emerging Stock Market since October 2010. Team Group Inc. also listed company at stock exchange market in January 2019. (Stock code: 4967)
TEAMGROUP is well praised by the industry and customers by adhering to the corporate philosophy of “Integrity, Innovation, Professionalism, Efficiency, Discipline, and Simplicity.” Every series of TEAMGROUP’s memory product is covered with full warranty services. We offer faster repair and exchange services than other brands and we guarantee to send RMA products back into the hands of every global customer with a minimum of delivery time.
By building the best technical team, laboratories, and manufacturing equipment, TEAMGROUP’s products are made with spirits of innovation and a strict quality control system. Our memory technology has passed the ISO9001 and ISO14001 certifications and is equipped with strong vertical integration ability of product design, material acquisition, manufacturing process, and quality testing. The result we have is that our latest over-clocking memory module is leading the industry. Recently, we have also devoted into industrial products to adapt to the rapidly changing industry environment. By introducing the concept of smart living and the use of cloud computing, we have shown our strength in R&D capabilities and we will further carry out the idea of One Stop Service to enhance customer services.
R&D and innovation
Stringent Quality Management
Eco-life for green living
Reinforced structure and enhanced heat dissipation
Designed for complete protection and enhanced heat dissipation, the heat spreader is formed by punch press process with a 0.8mm thick, one-piece alloy aluminum to reinforce the body structure. In addition, the electrolytic anodizing process can enhance corrosion resistance and make it non-conductive. Moreover, the superconductive thermal adhesive can maintain gaming memory within operating temperatures.
Selected IC chips. Stable and durable
The DDR4 gaming memory is made and selected through a rigorous testing process for complete compatibility and stability. This offers gamers a DDR4 memory with excellent quality, stability and compatibility.
High performance, low power consumption and upgrade easily
In addition to the increase in data transfer rate, the basic working voltage of the new generation of DDR4 memory is also decreased to 1.2V. This desktop memory is energy saving, high performance and low power consumption.
Supports Intel XMP and auto overclocking
T-FORCE VULCAN Z DDR4 Gaming Memory is plug and plays ready. Overclocking can be super easy without the hassle of manually adjusting the BIOS. It is compatible with both Intel & AMD platform, therefore gamers can easily enjoy overclocking without worries.
T-FORCE is TEAM force. The red “T” on the logo of “TF” represents TEAMGROUP’s passion for the storage products. The black “F” represents TEAMGROUP’s over 18 years of promotion of storage products. The visual design of the perfect combination elegantly symbolizes a pair of flying wings. They represent that the high quality and extreme performance gaming products from TEAMGROUP are capable of allowing all gamers to break the speed limit and enjoy the ever-changing world of gaming.